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Data Sheet
SMLK1 / SMLK2 series
lAttention Points In Handling
This product was developed as a surface mount LED especially suitable for reflow soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.④
The size and direction of the pad pattern depend on the condition of the PCB.
so, please investigate about the adjustment thoroughly before designing.
( n.b)
Performance/characteristics of devise shall considerably differ
depending on mounting conditions. That is to say, the optimized①
②
0.4
heat-radiation mounting will make best use of device’s performance.1.1
Thus, it in recommended to design the land pattern with use of
Cu for a great deal of heat-radiation as well as the use of metal mounting board. )
2.SOLDERING
LED products do not contain reinforcement
materials such as glass fillers.
Therefore, thermal stress by soldering greatly
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
3.USE OF AUTOMATIC MOUNTING MACHINE
As for this product, the silicone resin is used as encapsulate material and the sealing part on top of LED is soft.
Therefore, please make sure not to apply the pressure upon it, as it might influence reliability.
Moreover, please use the adsorption nozzle when you use the automatic mounting machine so as not to apply
the force directly to this top sealing part.
4.HANDLING AFTER MOUNTING
As shown right drawing, in case outside force is given
to the device, stress is concentrated to the jointed part
between mold resin and substrate.
Therefore there is a possibility to breath the device or PCB.
Careful handing is needed as ROHM cannot guarantee the falling
of the device by outside force after mounting.
Min.1 min③ ④Max. 40sec
Max.260oC, Within 10sec
140 to 180oC
230
to 260oC
(Fig-2)
(Fig-1)
Soldering
PCB
Emitting Direction
Outside Force
2.7
4
3.25
4.5
1.54
0.3
0.6
0.85
3.5
0.2
1.5
2
0.9
3.65
1.4
2.75
参考ランドパターン
③ ④
anode
① ②
cathode
③
④ ③
① ②
① ②
1.74
8/9
2014.01 - Rev.B
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